The thermal stress rapid change test chamber is suitable for assessing the ability of the entire device, components, parts, etc. to withstand sudden temperature changes. This temperature shock test can understand the impact of temperature changes on the test sample once or continuously multiple times. The main parameters that affect the temperature change test are the high and low temperature values within the temperature change range, the holding time of the sample at high and low temperatures, and the number of cycles of the test.

This test chamber is used for testing non heat dissipating test samples and low heat dissipating test samples. For the testing of heat dissipation test samples, their heat dissipation power cannot exceed the temperature controlled cooling capacity of the refrigeration system in this test chamber, otherwise it will affect the temperature conversion speed and ability of the test chamber. It is recommended that the heat dissipation capacity of the test sample be less than 300W. If the user has special requirements, our company can provide customized services for you.