The thermal stress rapid change test chamber system can be divided into two parts: a high-temperature chamber (preheating zone) and a low-temperature chamber (precooling zone). Rapid thermal shock testing is achieved by controlling a movable basket (test sample placement area) to quickly move to either the low-temperature or high-temperature chamber. During the test, the test sample moves along with the movable basket. Compared to high and low temperature (two chambers) thermal shock test chambers, the thermal stress rapid change test chamber has a faster temperature transition speed (stress change time less than 10 seconds), providing more stringent testing for the test samples.
Product Features
1. Modern design, latest modular manufacturing technology, and perfect control capabilities.
2. Intelligent and independent overload, overheat, power abnormality, overpressure, and actuator fault monitoring and protection design.
3. The test chamber undergoes defrosting once every 700 hours or more.
4. Independent anti-condensation function for the test sample, and over-temperature, no-wind, and smoke protection functions.
5. Breakthrough design with a rapid temperature stress change time of up to 10 seconds.
6. Intelligent and efficient servo cooling flow control technology, energy-saving, and rapid and precise temperature rise and fall.
7. Color screen 32-bit control system with Ethernet E-management and USB data access functions.
8. Unique operating mode design; after the test, the chamber returns to room temperature to protect the test sample.
9. Expandable APP mobile platform management.
10. Automatic reminders for equipment maintenance and fault record software design for the control system.
11. The testing program features user-friendly intelligent power-off reset, automatic memory continuation, and automatic origin start-up functions.
12. The equipment can be expanded with remote service capabilities and provides a training CD-ROM for machine operation.
Applications & Scenarios
1. Electronic Components and Circuit Board Testing:
Evaluate the thermal stress response of electronic components and circuit boards under rapid temperature changes, and test their stability and reliability under alternating high and low temperatures.
Test the performance degradation and lifespan of components such as chips, capacitors, resistors, and diodes under rapid thermal stress conditions.
2. Automotive Industry:
Evaluate the thermal stress response of automotive parts and vehicle systems under rapid temperature changes, and test their stability and durability in extreme temperature environments.
Test the performance of engine components, transmission systems, and body structures under rapid thermal stress conditions.
3. Aerospace:
Evaluate the thermal stress response of aerospace components and spacecraft materials under rapid temperature changes, ensuring their stability and reliability in space or high-altitude environments.
Test the performance of aircraft components, spacecraft parts, and external coatings under rapid thermal stress conditions. 4. Materials Science:
Evaluate the thermal stress response of new materials under rapid temperature changes, and study their stability and reliability in practical engineering applications.
Test the performance of composite materials, metallic materials, polymer materials, etc., under rapid thermal stress conditions.
5. Pharmaceuticals and Biotechnology:
Evaluate the stability and activity of pharmaceuticals and biological products under rapid temperature changes, ensuring their quality and efficacy during storage and transportation.
Test the performance of vaccines, biopharmaceuticals, biological samples, etc., under rapid thermal stress conditions.
6. Construction and Building Materials:
Evaluate the thermal stress response of building materials under rapid temperature changes, and test their stability and durability under different climatic conditions.
Test the performance of building materials such as concrete, glass, and metal structures under rapid thermal stress conditions.
